Event Overview
The Department of Electronics and Communication Engineering (ECE) at SRM University–AP is organising an expert webinar titled “More than Moore: Architecting the Future of Electronics via 3D Packaging.” As traditional transistor scaling reaches its physical and economic limits, the semiconductor industry is shifting towards heterogeneous integration and vertical stacking to sustain performance gains. This session introduces participants to the “More than Moore” paradigm, exploring how advanced 3D packaging architectures enable higher functional density, reduced latency, and improved power efficiency in next-generation electronic systems.
Led by Dr Patta Supraja, Assistant Professor in the Department of Electronics and Communication Engineering at SRM University–AP, the webinar will delve into the core engineering breakthroughs driving modern chiplet integration and vertical interconnects. Participants will gain insights into thermal management, structural reliability, and design trade-offs involved in stacking multiple semiconductor dies, equipping students and researchers with a clear understanding of emerging hardware trends shaping the future of microelectronics.
Resource Person
- Dr Patta Supraja